Layer 구조
Layer 설정은 Noise 와 Impedance 를 고려하여 설정한다.
배선층 설정 (예) |
: |
0.5 oz |
1.0 oz |
2.0 oz |
: |
Layer 설정 (예) |
AIR |
Conductor (배선 층) |
Dielectric (절연 층) |
Conductor (배선 층) |
Dielectric (절연 층) |
Conductor (배선 층) |
Dielectric (절연 층) |
Conductor (배선 층) |
AIR |
절연층 두께 (예) |
: |
1.0 T |
1.6 T |
2.4 T |
3.2 T |
: |
배선층 과 절연층 의 재질정보와 두께는 해당 PCB 제조업체의 정보를 바탕으로 임피던스를 설정하여 Artwork 시 이라한 정보를 바탕으로 한 ERC/DRC를 반영한다.
Air 는 상온(27º C) 을 기본으로 하며 특수온도에서 동작 시 Parameter를 보정한다
Layer 설정 |
Reference Sheet
Layer
배선
1
2
3
4
5
6
7
8
9
10
비고
2층
2
S1(G)
S2(P)
Lower-speed 디자인
4층
2
S1
G
P
S2
High Signal Impedance 와 Low Power Impedance를 유지하기 어려움
6층
4
S1
G
S2
S3
P
S4
Lower-speed 디자인, Poor Power High Signal Impedance에 적합
6층
4
S1
S2
G
P
S3
S4
Critical Signals을 S2층에 배선
6층
3
S1
G
S2
P
G
S3
Default Lower-speed Signals는 S2-S3층에 배선
8층
6
S1
S2
G
S3
S4
P
S5
S6
Default High-speed Signals는 S2-S3층에 배선, Poor Power Impedance 가짐
8층
4
S1
G
S2
G
P
S3
G
S4
Best for EMC
10층
6
S1
G
S2
S3
G
P
S4
S5
G
S6
Best for EMC, S4층은 Power Noise에 영향을 받기 쉬움
S = Signal Routing Layer P = Power G = Ground
Electric Characteristic
LAYER 재질 특성
E_CONDUCTIVITY
electrical conductivity
E_CONDUCTIVITY
thermal conductivity in XY plane
TZ_CONDUCTIVITY
thermal conductivity in XZ,YZ plane
DIELECTRIC
relative dielectric permittivity
LOSS_TANGENT
loss tangent of dielectric
THICKNESS
standard sheet thickness
The default materials for PCB layers are COPPER, FR-4, and AIR.
Surface materials
MATERIAL_NAME AIR
E_CONDUCTIVITY=0
T_CONDUCTIVITY=0.00027w/cm-degC
TZ_CONDUCTIVITY=0.00027w/cm-degC
DIELECTRIC=1
THICKNESS=0
MATERIAL_NAME CONFORMAL_COAT
E_CONDUCTIVITY=0
T_CONDUCTIVITY=0.001w/cm-degC
TZ_CONDUCTIVITY=0.001w/cm-degC
DIELECTRIC=3
THICKNESS=20um
MATERIAL_NAME ALUMINUM_HEAT_SINK
E_CONDUCTIVITY=3.767E+7
T_CONDUCTIVITY=2.37w/cm-degC
TZ_CONDUCTIVITY=2.37w/cm-degC
DIELECTRIC=1
THICKNESS=2mm
Flexible dielectric materials
MATERIAL_NAME COPPER
E_CONDUCTIVITY=595900mho/cm
T_CONDUCTIVITY=3.98w/cm-degc
TZ_CONDUCTIVITY=3.98w/cm-degc
DIELECTRIC=1
THICKNESS=1.2mil
MATERIAL_NAME PLATED_COPPER_FOIL
E_CONDUCTIVITY=343000mho/cm
T_CONDUCTIVITY=2.32w/cm-degc
TZ_CONDUCTIVITY=2.32w/cm-degc
DIELECTRIC=1
THICKNESS=2.1mi
PCB conductor materials
MATERIAL_NAME COPPER
E_CONDUCTIVITY=595900mho/cm
T_CONDUCTIVITY=3.98w/cm-degc
TZ_CONDUCTIVITY=3.98w/cm-degc
DIELECTRIC=1
THICKNESS=1.2mil
MATERIAL_NAME PLATED_COPPER_FOIL
E_CONDUCTIVITY=343000mho/cm
T_CONDUCTIVITY=2.32w/cm-degc
TZ_CONDUCTIVITY=2.32w/cm-degc
DIELECTRIC=1
THICKNESS=2.1mi
PCB dielectric materials
MATERIAL_NAME FR-4
E_CONDUCTIVITY=0
T_CONDUCTIVITY=0.012w/cm-degC
TZ_CONDUCTIVITY=0.002928w/cm-degC
DIELECTRIC=4.5
LOSS_TANGENT=0.035
THICKNESS=8.0mil
MATERIAL_NAME TETRAFUNCTIONAL
E_CONDUCTIVITY=0
T_CONDUCTIVITY=0.011w/cm-degC
TZ_CONDUCTIVITY=0.002928w/cm-degC
DIELECTRIC=4.4
LOSS_TANGENT=0.035
THICKNESS=8.0mil
MATERIAL_NAME POLYIMIDE
E_CONDUCTIVITY=0
T_CONDUCTIVITY=0.0018w/cm-degC
TZ_CONDUCTIVITY=0.0014w/cm-degC
DIELECTRIC=4.3 LOSS_TANGENT=0.035
THICKNESS=8.0mil
MATERIAL_NAME BT_EPOXY
E_CONDUCTIVITY=0
T_CONDUCTIVITY=0.0031w/cm-degC
TZ_CONDUCTIVITY=0.0022w/cm-degC
DIELECTRIC=4.1
LOSS_TANGENT=0.02
THICKNESS=8.0mil
MATERIAL_NAME CYANATE_ESTER_E
E_CONDUCTIVITY=0
T_CONDUCTIVITY=0.0041w/cm-degC
TZ_CONDUCTIVITY=0.0021w/cm-degC
DIELECTRIC=3.8
LOSS_TANGENT=0.009
THICKNESS=8.0mi
MATERIAL_NAME CYANATE_ESTER_S
E_CONDUCTIVITY=0
T_CONDUCTIVITY=0.0038w/cm-degC
TZ_CONDUCTIVITY=0.002w/cm-degC
DIELECTRIC=3.5
LOSS_TANGENT=0.009
THICKNESS=8.0mil
MATERIAL_NAME PTFE
E_CONDUCTIVITY=0
T_CONDUCTIVITY=0.0006w/cm-degC
TZ_CONDUCTIVITY=0.0006w/cm-degC
DIELECTRIC=2.7
LOSS_TANGENT=0.003
THICKNESS=5.0mil